Pulsed laser deposition (PLD) is a physical vapor deposition (PVD) technique where a high-power pulsed laser beam is focused inside a vacuum chamber to strike a target of the material that is to be deposited. This material is vaporized from the target (in a plasma plume) which deposits it as a thin film on a substrate (such as a silicon wafer facing the target). This process can occur in ultra high vacuum or in the presence of a background gas, such as oxygen which is commonly used when depositing oxides to fully oxygenate the deposited films.
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| - Pulsed laser deposition (PLD) is a physical vapor deposition (PVD) technique where a high-power pulsed laser beam is focused inside a vacuum chamber to strike a target of the material that is to be deposited. This material is vaporized from the target (in a plasma plume) which deposits it as a thin film on a substrate (such as a silicon wafer facing the target). This process can occur in ultra high vacuum or in the presence of a background gas, such as oxygen which is commonly used when depositing oxides to fully oxygenate the deposited films. While the basic setup is simple relative to many other deposition techniques, the physical phenomena of laser-target interaction and film growth are quite complex (see below). When the laser pulse is absorbed by the target, energy is first converted to electronic excitation and then into thermal, chemical and mechanical energy resulting in evaporation, ablation, plasma formation and even exfoliation. The ejected species expand into the surrounding vacuum in the form of a plume containing many energetic species including atoms, molecules, electrons, ions, clusters, particulates and molten globules, before depositing on the typically hot substrate.
- Импульсное лазерное напыление (или осаждение) (ИЛН(О)) (англ. pulsed laser deposition (PLD)) — получение плёнок и покрытий путём конденсации на поверхности подложки продуктов взаимодействия в вакууме импульсного лазерного излучения с материалом мишени (при абляции).
- Laserstrahlverdampfen, auch Laserverdampfen oder Laserdeposition genannt, (englisch pulsed laser deposition, PLD) ist ein Verfahren der physikalischen Gasphasenabscheidung (PVD-Verfahren) und eng verwandt mit dem thermischen Verdampfen. Man versteht darunter die Abscheidung von Schichten durch Laserablation. Hierzu werden sowohl der abzuscheidende Schichtwerkstoff (Target) als auch die Unterlage, auf der die Schicht abgeschieden werden soll (Substrat) in einem Vakuumbehälter (Rezipient) platziert.
- 脈衝雷射沉積（英語：Pulsed Laser Deposition，PLD），也被稱為脈衝雷射燒蝕（英語：pulsed laser ablation，PLA）為物理气相沉积(英語：Physical Vapor Deposition，PVD)的一種 , 是一種利用聚焦後的高功率脈衝雷射於真空腔體中對靶材進行轟擊，由於雷射能量極強，會將靶材汽化形成電漿蕈狀團(plasma plume)，並沉澱於基板上形成薄膜。 於鍍膜可於、或通入工作氣體(如欲沉積氧化物薄膜，通常會通入氧氣作為其工作氣體)的環境下進行。 於脈衝雷射沉積的過程中，雷射的能量被靶材吸收之後，能量首先激發靶材內部的電子躍遷，之後再轉成熱能等使靶材汽化形成電漿態，於電漿雲中，包含分子、原子、電子、離子、微粒、融球體等物質。
- L'ablation laser pulsé (en anglais Pulsed Laser Deposition ou PLD) est une méthode de dépôt en couches minces utilisant un laser de très forte puissance. Elle permet de facilement produire divers alliages binaires.
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| - Импульсное лазерное напыление (или осаждение) (ИЛН(О)) (англ. pulsed laser deposition (PLD)) — получение плёнок и покрытий путём конденсации на поверхности подложки продуктов взаимодействия в вакууме импульсного лазерного излучения с материалом мишени (при абляции).
- Pulsed laser deposition (PLD) is a physical vapor deposition (PVD) technique where a high-power pulsed laser beam is focused inside a vacuum chamber to strike a target of the material that is to be deposited. This material is vaporized from the target (in a plasma plume) which deposits it as a thin film on a substrate (such as a silicon wafer facing the target). This process can occur in ultra high vacuum or in the presence of a background gas, such as oxygen which is commonly used when depositing oxides to fully oxygenate the deposited films.
- Laserstrahlverdampfen, auch Laserverdampfen oder Laserdeposition genannt, (englisch pulsed laser deposition, PLD) ist ein Verfahren der physikalischen Gasphasenabscheidung (PVD-Verfahren) und eng verwandt mit dem thermischen Verdampfen. Man versteht darunter die Abscheidung von Schichten durch Laserablation. Hierzu werden sowohl der abzuscheidende Schichtwerkstoff (Target) als auch die Unterlage, auf der die Schicht abgeschieden werden soll (Substrat) in einem Vakuumbehälter (Rezipient) platziert.
- 脈衝雷射沉積（英語：Pulsed Laser Deposition，PLD），也被稱為脈衝雷射燒蝕（英語：pulsed laser ablation，PLA）為物理气相沉积(英語：Physical Vapor Deposition，PVD)的一種 , 是一種利用聚焦後的高功率脈衝雷射於真空腔體中對靶材進行轟擊，由於雷射能量極強，會將靶材汽化形成電漿蕈狀團(plasma plume)，並沉澱於基板上形成薄膜。 於鍍膜可於、或通入工作氣體(如欲沉積氧化物薄膜，通常會通入氧氣作為其工作氣體)的環境下進行。 於脈衝雷射沉積的過程中，雷射的能量被靶材吸收之後，能量首先激發靶材內部的電子躍遷，之後再轉成熱能等使靶材汽化形成電漿態，於電漿雲中，包含分子、原子、電子、離子、微粒、融球體等物質。
- L'ablation laser pulsé (en anglais Pulsed Laser Deposition ou PLD) est une méthode de dépôt en couches minces utilisant un laser de très forte puissance. Elle permet de facilement produire divers alliages binaires.
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| label
| - Ablation laser pulsé
- Deposició de làser polsat
- Laserstrahlverdampfen
- Pulsed laser deposition
- Импульсное лазерное напыление
- 脉冲激光沉积
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